China Unveils 15th Five‑Year Plan for Electronic Information Manufacturing

According to domestic industry news sources, the Ministry of Industry and Information Technology together with the National Development and Reform Commission have jointly issued the Development Plan for China’s Electronic Information Manufacturing Industry for the 15th Five‑Year Plan period, with key development targets set for the year 2030. By 2030, this industrial sector is expected to occupy a position of substantial weight within the global industrial landscape. Operating revenue generated by enterprises above the designated scale is projected to surpass 30 trillion yuan. A batch of competitive home‑grown technologies and finished products are anticipated to emerge across integrated circuits, advanced computing, consumer electronics, foundational electronic components and energy‑related electronics, alongside the growth of globally‑competitive leading corporations.

The official document also lays out targets for enhanced industrial innovation efficiency by 2030. Overall research and development intensity is meant to reach 3.5 per cent. Rapid breakthroughs are expected for core and critical technologies in priority fields, whilst computing supply capacity will expand markedly and uptake rates for new‑generation intelligent terminal applications will rise substantially. Fresh progress is foreseen in coordinated development spanning hardware, software, technical standards and intellectual property rights, helping to build a more robust industrial ecosystem.

Driven by accelerating breakthroughs in large‑scale artificial intelligence models and embodied intelligence, the electronic information manufacturing sector is entering a fresh growth cycle centred upon intelligence. China has long retained the world’s largest output volumes for mobile phones, microcomputers and colour television sets. Market expectations for intelligent, high‑quality and eco‑friendly goods keep rising across the 15th Five‑Year timeframe. Renewal‑driven consumption has become a primary engine for consumer upgrading. Transforming existing scale‑based advantages into systematic industrial strengths and shifting from sheer volume leadership towards superior product quality represents a major developmental priority for the whole sector.

The Plan arranges seventeen key tasks clustered under four principal orientations: consolidating industrial foundations, lifting product quality, fostering emerging growth areas and refining industrial governance. Work to reinforce foundational capabilities encompasses full‑chain research for integrated circuits, the high‑end upgrading of electronic components and materials, accelerated innovation and deployment for smart sensors, improved domestic supply of specialised electronic manufacturing equipment and measuring instruments, together with consolidated foundations for the photonics industry.

When it comes to nurturing new sources of industrial expansion, the policy text aims to consolidate existing strengths within energy electronics and support the growth of spatio‑temporal information industries. It seeks to reinforce the hardware infrastructure underpinning artificial intelligence, and push forward integrated innovation between digital‑intelligent technologies and industry‑specific electronics. Product iteration is to proceed for AI‑enabled mobile handsets, personal computers, smart eyewear, audio‑visual terminals, vehicle‑mounted equipment, industrial terminals and commercial‑grade terminal hardware. Broader usage scenarios and refined user experience form part of this work. Compatibility and adaptation work for edge‑side large models, computing chips, memory chips and operating systems will be strengthened to encourage deep integration between intelligent agents and physical end‑user devices.

End‑user terminals constitute the fundamental bedrock of industrial scale, and act as the vital gateway through which intelligent technologies reach mass consumers. The policy promotes intelligent remodelling for traditional established product lines. Iteration speeds rise for AI‑capable mobile phones and personal computers, with targeted progress on edge‑side large‑model deployment, edge‑cloud collaborative architectures and multi‑modal natural interaction technologies. Embedding large‑model capabilities directly inside local‑run hardware is intended to unlock replacement demand within the huge existing stock market. New‑form hardware gateways will also be cultivated, covering wearable devices such as smart glasses and virtual‑reality headsets, whole‑house smart systems, automotive electronics and intelligent robots. Standard‑setting initiatives are designed to help consumers recognise and select high‑grade intelligent merchandise more readily.

Industry forecasts indicate that sales volumes of artificial‑intelligence‑enabled mobile phones and personal computers may outstrip sales for their non‑AI counterparts during 2026. The terminal hardware market is moving away from simple stock‑based product replacement and entering a new cycle defined by intelligent upgrading.

Nine special thematic columns are embedded within the overall framework of the Plan to advance priority assignments. Initiatives include the expansion of advanced data‑storage capacity, the development of next‑generation computing hardware built around heterogeneous computing architectures, and the construction of a complete industrial chain for space‑based computing. Research work will cover model deployment techniques and intelligent scheduling mechanisms. High‑safety automated driving control units, smart cabin systems and vehicle‑road cooperative terminal products are also marked out for development.

The whole electronic‑information manufacturing chain will achieve integrated growth across upstream, midstream and downstream segments throughout the 15th Five‑Year period. Upstream segments will witness accelerated expansion for foundational electronic materials and dedicated manufacturing equipment, alongside quality improvements for AI‑related electronic components and automotive‑grade electronic hardware. Midstream activities will support greater market penetration for AI‑powered consumer terminals, wearable gadgets and smart household appliances. Further downstream, these technologies will empower smart city infrastructure, digital healthcare services and low‑altitude economy applications. Multiple niche market segments hold clear potential for further expansion.

今天 11:47